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SanDisk promotes Gene Rosenthal to Vice President
Dennis Hissink : April 28th 2005 - 08:30 CET
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 SanDisk promotes Gene Rosenthal to Vice President : SanDisk Corporation announced the promotion of Gene Rosenthal to vice president of product and test engineering. Rosenthal, who joined SanDisk in 1990 as the company's first product test engineer, will report to Jose Flahaux, senior vice president of worldwide operations. Rosenthal will oversee all test and product engineering at SanDisk's various production and assembly facilities in Japan, Taiwan, China and Israel. One of his key tasks is to implement wafer testing at the new Fab 3 manufacturing plant in Yokkaichi, Japan, where SanDisk and Toshiba have a partnership to produce 300mm wafers that yield NAND flash memory chips. The plant is expected to begin operations this summer.
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 Gene Rosenthal - pioneer for SanDisk
"Gene was SanDisk's first product and test engineer for flash memory, ASIC controllers and flash cards," said Flahaux. "He was instrumental in defining and developing all test processes for SanDisk's first NOR-style flash memory from wafers to our first flash drive. Working with Toshiba, he was also responsible for building a strong NAND flash memory team in product and test engineering. And he successfully brought up multiple factories in Asia to support wafer sort, final test and card test for all SanDisk product lines.
SanDisk - Use the Experience of Gene Rosenthal
"In the future, his experience will be invaluable in helping SanDisk meet worldwide market demands and in maintaining our leading edge in flash memory technology," Flahaux added. Rosenthal's promotion to the newly-created post is effective immediately. Previously, Rosenthal held positions of senior director, director and manager of product and test engineering at SanDisk. Prior to becoming employee #23, Rosenthal worked at Seeq Technology as test and product engineering manager and, before that, at National Semiconductor as a test engineer.
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