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Samsung 1 Gigabit mobile DRAM introduction
Mark Peters : March 24th 2005 - 02:00 CET
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 Samsung 1Gigabit mobile DRAM : Samsung Electronics, leader in advanced semiconductor technology, today demonstrated the world's first 1 Gigabit (Gb) mobile DRAM, and unveiled five other leading-edge mobile technologies that underscore its leadership in driving innovation and efficiency within the mobile industry. The advancements announced included a System-in-Package (SiP) with a 300MHz mobile CPU, a 1Gigabit (Gb) NAND flash memory, a 56Megabit (Mb) mobile DRAM, a 260K color display driver IC (DDI) for active matrix OLEDs (organic light emitting diodes), a quad video graphics array (QVGA) resolution one-chip DDI, and a 2.5-inch QVGA thin-film-transistor, liquid crystal display (TFT-LCD) for MP3 players.
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 Samsung - Advanced Package
Conference attendees were shown Samsung's new SiP - the first package containing a 300MHz mobile CPU, a 1Gb NAND Flash memory and a 256Mb mobile DRAM. The high density and high-performance logic-CPU design will accommodate the increasingly large data processing and storage needs of portable game consoles, handsets, camcorders and PDAs (personal data assistants). By combining memory and system LSI technology, Samsung is coupling proven components within advanced package technology to improve mobile system integration, reduce power consumption and minimize size limitations. SiPs also reduce interference between devices, adding significantly to system reliability.
Samsung - High Density Mobile DRAM
Samsung displayed another major innovation at its Mobile Forum, a 1Gb mobile DRAM, the first one-gigabit memory device to be publicly exhibited. The 1Gb mobile DRAM will support higher data processing requirements in graphics-enhanced digital camcorders, while accommodating five megapixel and higher resolutions in digital still cameras. The newly developed SDRAM operates at 664 megabytes per second and has been optimized to function at 1.8 volts in maximizing battery life through the use of Samsung proprietary partial array self refresh (PASR) and temperature compensated self refresh (TCSR) technologies.
Samsung - Display Driver ICs
Samsung's 260K color display driver IC (DDI) for AM OLEDs utilizes 0.25um process technology to reduce the size of the device to approximately 40 percent of leading competitive models. The DDI for AM OLED features a quarter common interchange format (qCIF, 176xRGBx240 pixel) along with a 1.8 volt power level. With its new AM OLED application, Samsung now has developed the widest range of DDI technology including STN, TFT-LCD and AM OLED. Also at the conference, Samsung announced a high resolution quad video graphics array (QVGA, 240xRGBx320 pixel). The QVGA DDI device features a built-in timing controller IC, a source driver, a gate driver, 1.3Mb SRAM and a power supply circuit. This five-in-one-chip solution was designed using 0.18um process technology and utilizes micro-pad pitching technology.
Samsung - TFT-LCD for MP3s
In its final public unveiling at the Mobile Forum, Samsung previewed a TFT-LCD for MP3 players. The new 2.5-inch panel features crisp QVGA display resolution. Samsung proprietary Vertical Alignment (VA) technology enables wide viewing angles for optimal viewing of music videos and other visual displays that accompany MP3 music files.
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