Canon EOS M5 Fujifilm GFX 50S Sony CyberShot RX100 V Nikon D5600 Panasonic Lumix GH5 Sony Alpha 6500
Canon EOS M5 Fujifilm GFX 50S Sony CyberShot RX100 V Nikon D5600 Panasonic Lumix GH5 Sony Alpha 6500
  News Headlines APPLE CANON FUJIFILM HTC HUAWEI LG MICROSOFT NIKON OLYMPUS PANASONIC PENTAX SAMSUNG SONY  
Samsung Galaxy
 
     
Powered by True
Counted by OneStat.com
Dennis Hissink : January 17th 2005 - 02:00 CET

Samsung eight-die Multi Chip Package introduction


Digital Camera Review Test Appareil Photo Numerique Prueba camara digital Digitale Camera Test Dijital Kamera Incelemeleri Digitalkamera Test Digitalkamera
SamsungSamsung eight-die Multi Chip Package introduction: Samsung announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices. As the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to makes wafers thinner during design processing, Samsung has been able to minimize overall chip thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2Gb in a package that is 1.4mm thick, equalling the thickness of a four-die MCP solution.
Samsung eight-die Multi Chip Package introductionSamsung eight-die Multi Chip Package
The new eight-chip MCP is an very compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster Internet access. The new eight-die MCP uses all the memory chips avail- able today for mobile products in a single 11x 14x1.4mm package. It inclu- des two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.

Samsung eight-die Multi Chip Package - 3G mobile phone market
The market research organization, iSuppli, has predicted that the 3G mobile phone market will expand an average of 87 percent a year. Samsung Electronics, a leader in next-generation multi-function package technology, is the world's largest supplier of DRAM, SRAM and NAND flash memory chips.





   Samsung Digimax V700 digital camera introduction
   Samsung YP-T7 Picture Viewer and Audio Player introduction
   Samsung Micro HDD Jukebox & Photo album introduction
   Next  Photo Finale Premium 3.0
   Previous  Olympus Mju mini DIGITAL digital camera review
   News by brand:Samsung
   News by category:Innovations
   News by brand and category:Samsung Innovations


Android smartphone
Latest Samsung announcements
Samsung Galaxy Book 2-in-1 tablet
Samsung Tab S3 delivers 4K video playback
Premium Exynos 9 processor runs 4K Virtual Reality
Terrorism area Molenbeek becomes innovation center
Samsung QLED TV series produces best color volume
Samsung Galaxy C9 Pro smartphone officially launched
Samsung Odyssey premium notebook
Self-service kiosk offers premium Samsung products
Samsung Galaxy A 2017 smartphones
Samsung Smart TV services launched at 2017 CES
Samsung Home Entertainment products at CES 2017
CES 2017 will showcase latest Samsung monitors
Samsung smartwatch features Lonely Planet app
Samsung CES 2017 Innovation Awards
Samsung Gear S3 series with LTE and Bluetooth models
 
Twitter LetsGoDigital
Latest news headlines
Samsung premium mobile electronics
Samsung Galaxy Book 2-in-1 tablet
Samsung Tab S3 delivers 4K video playback
G6 from LG delivers outstanding 4K image quality
LG Dolby Vision Android phone
LG G6 Premium smartphone with Dolby Vision
P10 Series official announced by Huawei Mobile
LG X power2 Android phone with powerful battery
BlackBerry KEYone smartphone with security features
VTech launches smartwatch and action camera for kids
LG Gram notebook series for the mobile lifestyle
BlackBerry KEYone phone with full-sized keyboard
Content transfer service for Apple smartphones
Garmin equips cycling teams with premium accessories
Acer to showcase air measurement device at 2017 MWC
   
CanonCasioFujifilmNikonOlympusHTCSamsungSonyPanasonicNokia
  Accessories Android Apps Camcorders Digital cameras Mobile phones Smartphones Software Tablets   CES CeBIT Gadgets IFA Photokina PMA