Samsung NX500 Sony CyberShot HX90 Canon PowerShot G3 X Panasonic DMC-FZ330 Nikon Coolpix P900 Olympus Stylus 1s
Samsung NX500 Sony CyberShot HX90 Canon PowerShot G3 X Panasonic DMC-FZ330 Nikon Coolpix P900 Olympus Stylus 1s
  News Headlines APPLE CANON FUJIFILM HTC HUAWEI LG MICROSOFT NIKON OLYMPUS PANASONIC PENTAX SAMSUNG SONY  
Lets Go Digital
 
     
Powered by True
Counted by OneStat.com
Samsung eight-die Multi Chip Package introduction
Dennis Hissink : January 17th 2005 - 02:00 CET
Digital Camera Review Test Appareil Photo Numerique Prueba camara digital Digitale Camera Test Dijital Kamera Incelemeleri Digitalkamera Test Digitalkamera
SamsungSamsung eight-die Multi Chip Package introduction: Samsung announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices. As the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to makes wafers thinner during design processing, Samsung has been able to minimize overall chip thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2Gb in a package that is 1.4mm thick, equalling the thickness of a four-die MCP solution.
Samsung eight-die Multi Chip Package introductionSamsung eight-die Multi Chip Package
The new eight-chip MCP is an very compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster Internet access. The new eight-die MCP uses all the memory chips avail- able today for mobile products in a single 11x 14x1.4mm package. It inclu- des two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.

Samsung eight-die Multi Chip Package - 3G mobile phone market
The market research organization, iSuppli, has predicted that the 3G mobile phone market will expand an average of 87 percent a year. Samsung Electronics, a leader in next-generation multi-function package technology, is the world's largest supplier of DRAM, SRAM and NAND flash memory chips.





   Samsung Digimax V700 digital camera introduction
   Samsung YP-T7 Picture Viewer and Audio Player introduction
   Samsung Micro HDD Jukebox & Photo album introduction
   Next  Photo Finale Premium 3.0
   Previous  Olympus Mju mini DIGITAL digital camera review
   News by brand:Samsung
   News by category:Innovations
   News by brand and category:Samsung Innovations


LetsGoDigital digital camera magazine
Latest Samsung announcements
Samsung Gear S3 series with LTE and Bluetooth models
Silicon Valley 5G Summit
Samsung Galaxy Tab A tablet
Samsung collaborates with leading Russian operator
Samsung Galaxy Note 7 recall in US
Samsung Gear S3 SmartWatch
Samsung Galaxy J-Series of Android smartphones
Galaxy Note7 comparison
Samsung Android tablet with Iris recognition
Samsung Galaxy Note 7 Android smartphone
New Galaxy smartphone with Turbo Speed Technology
New smartphone technology by Samsung
Samsung Galaxy On Pro smartphone series
Samsung removable flash memory cards
Samsung Galaxy S7 Edge Limited Edition
 
Twitter LetsGoDigital
Latest news headlines
Samsung CES 2017 Innovation Awards
CES 2017 Show security measures
Indiegogo campaign: Android smartphone camera
Amazfit Pace GPS running watch
Target Cyber Week with 15 percent discount
2017 CES Keynote speakers
Why smartphones will never replace cameras
T-Mobile becomes ultimate giving machine
Sprint Black Friday offers
ZTE Grand X 4 Android smartphone
U.S. Cellular Black Friday deals
Newegg Black Friday and Cyber Monday deals
Matrix smartwatch with thermoelectric technology
Panasonic high-volume production scanner
CES 2017 Keynote with Qualcomm CEO
   
CanonCasioFujifilmNikonOlympusHTCSamsungSonyPanasonicNokia
  Accessories Android Apps Camcorders Digital cameras Mobile phones Smartphones Software Tablets   CES CeBIT Gadgets IFA Photokina PMA