Samsung NX3000 Canon PowerShot G7 X Nikon Coolpix S6900 Panasonic Lumix ZS40 Canon PowerShot SX700 Sony CyberShot HX400V
Samsung NX3000 Canon PowerShot G7 X Nikon Coolpix S6900 Panasonic Lumix ZS40 Canon PowerShot SX700 Sony CyberShot HX400V
  News Headlines Apple Canon Casio Fujifilm HTC LG Nikon Nokia Olympus Panasonic Pentax Ricoh Rollei Samsung Sony  
Lets Go Digital
 
     
Powered by True
Counted by OneStat.com
Samsung eight-die Multi Chip Package introduction
Dennis Hissink : January 17th 2005 - 02:00 CET
Digital Camera Review Test Appareil Photo Numerique Prueba camara digital Digitale Camera Test Dijital Kamera Incelemeleri Digitalkamera Test Digitalkamera
SamsungSamsung eight-die Multi Chip Package introduction: Samsung announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices. As the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to makes wafers thinner during design processing, Samsung has been able to minimize overall chip thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2Gb in a package that is 1.4mm thick, equalling the thickness of a four-die MCP solution.
Samsung eight-die Multi Chip Package introductionSamsung eight-die Multi Chip Package
The new eight-chip MCP is an very compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster Internet access. The new eight-die MCP uses all the memory chips avail- able today for mobile products in a single 11x 14x1.4mm package. It inclu- des two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.

Samsung eight-die Multi Chip Package - 3G mobile phone market
The market research organization, iSuppli, has predicted that the 3G mobile phone market will expand an average of 87 percent a year. Samsung Electronics, a leader in next-generation multi-function package technology, is the world's largest supplier of DRAM, SRAM and NAND flash memory chips.

   Samsung Digimax V700 digital camera introduction
   Samsung YP-T7 Picture Viewer and Audio Player introduction
   Samsung Micro HDD Jukebox & Photo album introduction
   Next  Photo Finale Premium 3.0
   Previous  Olympus Mju mini DIGITAL digital camera review
   News by brand:Samsung
   News by category:Innovations
   News by brand and category:Samsung Innovations
   Canon EOS 700D - $579.99
   Nikon D7100 - $609.00
   Sony Alpha 6000 - $442.11
   Nikon D5300 - $601.71
   Canon EOS 70D - $709.00
   Sony CyberShot DSC RX100 III - $625.00
   Canon PowerShot G1 X Mark II - $599.00
   Samsung NX300 - $549.00
   Panasonic Lumix DMC LX7 - $299.00
   Nikon D3300 - $345.00


LetsGoDigital digital camera magazine
Latest Samsung announcements
Samsung Tizen Dual-SIM smart phone
Samsung Galaxy S6
Samsung Galaxy S6 Edge
Samsung NX500
Samsung Gear VR 3D Mobile Game
Samsung NX1 camera update
Samsung Z1
Samsung Z1 Tizen smartphone
Samsung Galaxy A7
Samsung SUHD
Samsung SUHD TV
Samsung Curved Monitor
Samsung ATIV Book 9
Samsung Audio products at CES 2015
Samsung Virtual Reality glasses
 
Twitter LetsGoDigital
Latest news headlines
Pentax K-3 II
4K Video recording with the Nikon 1 J5
Sony 4k Handycam camcorder
Sony high zoom compact cameras
Olympus Tough TG-4 accessories
Olympus Stylus Tough TG-4
Olympus Stylus 1s
Nikon 1 J5
Nikon 1 J5 system camera
Samsung Galaxy S6 edge accessories
BlackBerry Leap smartphone for 4G LTE networks
Microsoft Lumia 430 Dual SIM
Microsoft Lumia 640 XL
Microsoft Lumia 640
Olympus Stylus SH-2
   
CanonCasioFujifilmNikonOlympusHTCSamsungSonyPanasonicNokia
  Accessories Android Apps Camcorders Digital cameras Mobile phones Smartphones Software Tablets   CES CeBIT Gadgets IFA Photokina PMA