Samsung NX500 Sony CyberShot HX90 Canon PowerShot G3 X Panasonic DMC-FZ330 Nikon Coolpix P900 Olympus Stylus 1s
Samsung NX500 Sony CyberShot HX90 Canon PowerShot G3 X Panasonic DMC-FZ330 Nikon Coolpix P900 Olympus Stylus 1s
  News Headlines Apple Canon Fujifilm HTC Huawei LG Microsoft Nikon Olympus Panasonic Pentax Samsung Sony  
Lets Go Digital
 
     
Powered by True
Counted by OneStat.com
Samsung eight-die Multi Chip Package introduction
Dennis Hissink : January 17th 2005 - 02:00 CET
Digital Camera Review Test Appareil Photo Numerique Prueba camara digital Digitale Camera Test Dijital Kamera Incelemeleri Digitalkamera Test Digitalkamera
SamsungSamsung eight-die Multi Chip Package introduction: Samsung announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices. As the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to makes wafers thinner during design processing, Samsung has been able to minimize overall chip thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2Gb in a package that is 1.4mm thick, equalling the thickness of a four-die MCP solution.
Samsung eight-die Multi Chip Package introductionSamsung eight-die Multi Chip Package
The new eight-chip MCP is an very compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster Internet access. The new eight-die MCP uses all the memory chips avail- able today for mobile products in a single 11x 14x1.4mm package. It inclu- des two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.

Samsung eight-die Multi Chip Package - 3G mobile phone market
The market research organization, iSuppli, has predicted that the 3G mobile phone market will expand an average of 87 percent a year. Samsung Electronics, a leader in next-generation multi-function package technology, is the world's largest supplier of DRAM, SRAM and NAND flash memory chips.

   Samsung Digimax V700 digital camera introduction
   Samsung YP-T7 Picture Viewer and Audio Player introduction
   Samsung Micro HDD Jukebox & Photo album introduction
   Next  Photo Finale Premium 3.0
   Previous  Olympus Mju mini DIGITAL digital camera review
   News by brand:Samsung
   News by category:Innovations
   News by brand and category:Samsung Innovations
   Sony Alpha 6000 - $548.00
   Sony CyberShot DSC RX100 IV - $
   Panasonic Lumix DMC LF1 - $
   Nikon D750 - $1996.95
   Nikon D7200 - $849.00
   Nikon D3300 - $396.95
   Canon EOS 760D - $849.99
   Canon EOS 750D - $749.00
   Samsung NX3000 - $
   Nikon D3200 - $349.00


LetsGoDigital digital camera magazine
Latest Samsung announcements
Samsung Gear 360 virtual reality camera
Samsung Galaxy S7 smartphones
Samsung SUHD TV Lineup
Samsung Gear 2 smartwatch collection
Samsung Notebook 9 Series
Samsung Galaxy Tab Pro S
Samsung SSD T3 external Solid State Drive
Samsung Smart TV offers enhanced Smart Hub
Samsung Audio products at CES 2016
Samsung Galaxy A smartphone series
Samsung Z3 Tizen-based smartphone
Samsung Accessories for Galaxy Devices
Samsung Galaxy View
Samsung Home Monitoring Kit
Samsung Galaxy Tab 3 Lite tablet
 
Twitter LetsGoDigital
Latest news headlines
LG Stylo 2 smartphone with Android 6.0 Marshmallow
Leica M-D digital rangefinder camera
HTC One M9 Prime Camera Edition
Lenovo ZUK Z2 Pro Android phone
ZTE Blade L5 Plus budget phone
ZTE Blade S7 smartphone with catchy appearance
Three cheap Android-based smartphones
Microsoft Lumia 650 business phone
Fujifilm X-T10 premium interchangeable lens camera
Samsung Galaxy S7 available colors
SanDisk Extreme Plus MicroSDXC memory card
Fujifilm X-series mirrorless infrared camera
Canon EOS Rebel T6 entry-level DSLR camera
Huawei P9 smartphone series
Huawei P9 Plus
   
CanonCasioFujifilmNikonOlympusHTCSamsungSonyPanasonicNokia
  Accessories Android Apps Camcorders Digital cameras Mobile phones Smartphones Software Tablets   CES CeBIT Gadgets IFA Photokina PMA