|
|
Ralf Jurrien : 2007-09-19 18:00:00
|
|
Universal Flash Storage specification : Micron Technology, Nokia, Samsung Electronics, Sony Ericsson, Spansion Inc., STMicroelectronics, and Texas Instruments announced that they support the creation of a far-ranging industry specification for removable memory cards and embedded memory solutions being standardized by the JEDEC Solid State Technology Association, a leading open-standards organization in the semiconductor industry. JEDEC is well known for its expertise in the standardization of component technologies and solutions. The specification, dubbed Universal Flash Storage (UFS), reflects the industry's need for a universal memory solution that removes the need for adaptors to accommodate different removable memory card sizes.
|
|
Ralf Jurrien : 2007-04-12 22:00:00
|
|
Three Megapixel camera sensor for mobile phones : Micron Technology unveiled a 1/4-inch, 3-megapixel complete camera system-on-chip (SOC) sensor for mobile handsets. Unique to the market, Micron has designed an anti-shake feature into the camera sensor, which greatly reduces image blurring often found in camera phone pictures due to camera shake. Blurry images are especially common in low-light situations where the shutter is open for longer periods of time to collect enough light to take the picture. A camera phone designed with Micron’s new sensor (product number MT9T111) can dramatically reduce image blur by automatically activating the anti-shake feature when sensing camera shake.
|
|
Ralf Jurrien : 2007-02-13 18:57:06
|
|
Camera phone image sensors at 3GSM : At 3GSM, Micron Technology, introduced a line-up of image sensors that create a powerful imaging platform for next-generation camera phones. Micron’s camera phone sensors were developed using a tiny 1.75-micron pixel design and range in resolution from 5-, 3- and 1.3-megapixel. As the imaging market share leader for handsets, Micron is focused on developing leading-edge sensor innovations and improving the camera phone experience, encouraging new uses and opportunities for the technology. General customer sampling for the 5- and 3-megapixel sensors is planned for the second quarter 2007 and the 1.3-megapixel sensor is expected to sample in late first quarter 2007.
|
1
|
|
|
