Toshiba Dynastron CMOS image sensor : Toshiba America Electronic Components, Inc. today announced the further expansion of its industry-leading Dynastron complementary metal oxide semiconductor (CMOS) image-sensor product line with the addition of two new chips, the 3.2 megapixel ET8EE6-AS CMOS image sensor and 2.0 megapixel ET8EF2-AS CMOS image sensor SoC with integrated image-signal processor (ISP). With a pixel pitch of just 2.2 microns, a significant advance in cell-size miniaturization compared to the 2.7-micron pixel pitch of previous 2- and 3.2-megapixel products, they enable development of smaller, space-saving camera modules for cellular phones and other camera-enabled mobile devices.
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