Dongbu provides wafer processing for Foveon Sensors : Dongbu Electronics disclosed it has been working closely with Silicon Valley based Foveon since Q4 of 2004 to support the fabless manufacturer’s development of the world’s highest resolution CMOS Sensor (CIS) devices. Volume production of the latest Foveon X3 direct image sensors, featuring resolutions up to 14.1 Megapixels for professional digital photography, will ramp to more than 1,000 8-inch wafers per month utilizing Dongbu’s special CIS wafer processing technology at the 180nm node. Dongbu reports that it has manufactured more than 1,500 pre-production samples of Foveon’s new 14.1 Megapixel device since May to verify the new device’s exceptional performance in silicon.
Foveon X3 DSLR image sensor Foveon released the 14.1 megapixel X3 DSLR image sensor, the highest resolution X3 sensor available and the latest product from Foveon. In addition to providing image quality suitable for professional photographers, the new X3 sensor incorporates design and process enhancements which improve performance at long exposures and high ISO speeds, and also provides a 40% increase in pixel count compared to the previous X3 DSLR sensor. Foveon’s proprietary X3 technology is the only image sensor technology that stacks red, green and blue pixels vertically, increasing the information density of the recorded image while simultaneously eliminating the color sampling artifacts found with other image sensors.
