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Mark Peters : 2005-11-28 09:19:54
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Samsung Electronics develops largest flexible LCD panel : Samsung Electronics, announced today that it has developed the world’s largest transmissive TFT LCD (thin-film transistor, liquid crystal display), with sufficiently high resolution to display digital television content.The seven-inch, 640x480 (VGA-standard) flexible display uses a transparent plastic substrate that is thinner, lighter and more durable than the conventional LCD glass panels used today. Moreover, the full-color transmissive LCD panel maintains a constant thickness even when it is bent. Considered the next-generation in flat panel displays, this technology involves the use of pliable plastic instead of rigid glass substrates in TFT-LCD production.
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Dennis Hissink : 2005-03-21 08:41:11
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Samsung mSWV+ technology introduction : Samsung Electronics, the world's leading supplier of thin-film-transistor, liquid crystal displays (TFT LCD), has developed a new design for mobile displays 10 inches or smaller that allows viewing of ultra-sharp LCD images at a 160-degree viewing angle in a variety of low or high ambient lighting conditions. The company's proprietary PVA technology, which until now has been used to improve off-axis viewing characteristics for large-sized LCDs, has been successfully adapted to work with small and medium-sized LCDs. When combined with a transflective mobile display mode, the new mobile Super Wide View+, mSWV+ technology, will enable a new generation of rotational, mobile multimedia displays.
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Dennis Hissink : 2005-01-17 02:00:02
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Samsung eight-die Multi Chip Package introduction: Samsung announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices. As the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to makes wafers thinner during design processing, Samsung has been able to minimize overall chip thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2Gb in a package that is 1.4mm thick, equalling the thickness of a four-die MCP solution.
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