LG G6 review Samsung Galaxy S8 Apple iPhone X Samsung Galaxy Note 8 HTC U 11 Sony Xperia L1
LG G6 review Samsung Galaxy S8 Apple iPhone X Samsung Galaxy Note 8 HTC U 11 Sony Xperia L1
  2017 NEWS APPLE CANON FUJIFILM HTC HUAWEI LG MOTOROLA NIKON NINTENDO NOKIA OLYMPUS PANASONIC PENTAX SAMSUNG SONY  
Apple iPhone
 
     
Powered by True
Counted by OneStat.com
Ilse Jurriën : July 20th 2007 - 11:33 CET

Olympus FR3200 wafer inspection


Digital Review Test Appareil Photo Numerique Prueba camara digital Camera Review Dijital Kamera Incelemeleri Digitalkamera Test Digitalkamera
OlympusOlympus FR3200 wafer inspection : Olympus Integrated Technologies America (Olympus-ITA), leader in quality inspection and defect review systems, will demonstrate its FR3200 200 and 300mm Wafer Inspection and Automated Defect Review System at SEMICON West 2007. In addition to the broad range of visible light imaging methods, the system integrates a new Broadband DUV technology for better material contrast and characterization on advanced films and materials. The new multiple band DUV optics provide imaging in single or combined UV and DUV bands. With the advent of many new materials in front-end processing, this flexible multiple band DUV observation method will be very powerful in characterization of advanced material defects.
Olympus FR3200 wafer inspectionOlympus FR3200 wafer inspection
Observation techniques of the FR3200 include Bright Field, Dark Field, Differential Interference Contrast (Nomarski), Confocal, UV and Multi-Band UV, allowing the user to observe inspection points and defects under a wide variety of optics, magnifications and illumination. A tracking laser auto focus keeps the wafer focused in all observation modes. Images of the wafer are displayed in a live video window and automatically captured and stored. The FR3200 also includes macro observation under various selectable wavelength illuminations.

Olympus FR3200 wafer inspection - Auto focus
In order to provide a well focused image on all process steps, a variety of focus methods are necessary. The FR3200 provides a multi spot laser auto focus, focus offsets, video contrast auto focus, and extended focus imaging methods. The focus method can be programmed as part of the inspection or defect review recipe, allowing the user to tune the recipe for best image quality at each process step, ensuring the most consistent and accurate inspection and defect review results.

Olympus FR3200 extended focus imaging
The FR3200’s Extended Focus Imaging (EFI) allows the user to capture images at various focal planes and quickly combine them into a single image with a greatly increased depth of focus. EFI is indispensable when observing tall film stacks or when trying to observe defects in deep trenches. Without this feature it might not be possible to see defects at certain layers and the amount of information provided by the image can be severely decreased.

Olympus FR3200 wafer inspection software
The FR3200 is delivered standard with manual inspection software, manual defect review software (MDR), and automated defect review (ADR) software. Automated defect classification (ADC) software is optional. The ADC software option will automatically classify defects and update the KLARF files for export to the yield management system or downstream tools.

Olympus Software Framework (OSF) architecture
The system is equipped with Olympus Software Framework (OSF) architecture, a very flexible architecture that allows software development for new applications and features to be developed quickly by re-using existing software components. OSF’s flexibility enables the tool to be very configurable, meeting a variety of applications in many parts of the fab so there can be a common inspection and review platform in almost all parts of the fab, both front and back end. Common platforms save hardware, facilities, training, and operation costs to reduce overall CoO.

Olympus FR3200 wafer inspection
The FR3200 provides both 200 and 300mm inspection and review capabilities in a single system with minimal footprint. A flexible load port configuration makes the system adaptable to any manufacturing layout requirement. The system can be configured with any combination of SEMI-E63 Bolts-M compatible load ports and can be configured so that the tool has 200 and 300mm capability simultaneously without any setup or change required. High speed robotic wafer handling helps ensure high throughput.

About Olympus-Integrated Technologies of America
Olympus Integrated Technologies America, Inc. (Olympus-ITA) was founded in March 2000 as a wholly owned subsidiary of Olympus Corporation, Tokyo, Japan. Specializing in semiconductor products and systems for wafer inspection and defect review, Olympus-ITA is responsible for sales and marketing of semiconductor systems in the United States and is also the application software development R&D center for Olympus semiconductor products. Its location in San Jose, California, enables the company to respond quickly to provide sales, service, and support to semiconductor companies throughout the United States.





   Olympus digital cameras
   Olympus camera reviews
   Printers
   Next  ExpressCard to PCMCIA and CardBus adapter
   Previous  LaCie names New Vice President of US Sales
   News by brand:Olympus
   News by category:Printers
   News by brand and category:Olympus Printers


Android smartphone
Latest Olympus announcements
Olympus Tough TG-5 waterproof digital camera
Olympus donates volunteer time to local charities
Waterproof Olympus Tough TG-5 camera
Olympus discount deals on camera bodies and lenses
Olympus OM-D E-M1 Mark II body available this year
Olympus STF-8 macro twin flash
Olympus PEN E-PL8 test pictures
Olympus FL-900R flash
Olympus M.Zuiko Digital ED 12-100mm lens
Olympus M.Zuiko Digital ED 25mm lens
Olympus M.Zuiko Digital ED 30mm macro lens
Olympus PEN E-PL8 system camera
Olympus announces development of OM-D E-M1 Mark II
Olympus FD-1 flash diffuser
Olympus Tough TG-870
 
Latest news headlines
Apple Pay Cash coming to Europe
Dutch startup will change Li-Ion battery industry
Popular holiday toys in 2017
Huawei Mate 10 Pro specs surface
Samsung Premier Cinema LED screen
Panasonic Lumix GH5 review with firmware v2.0
Sony PlayStation VR headset released
Huawei EnVizion 360 VR Camera
New BlackBerry phone coming up
Honor 6C Pro surfaces
Huawei Pay mobile payment service for United States
Full-grain leather iPhone X cases from Dutch vendor
GoPro Fusion 360 degree camera to launch at CES 2018
Apple iPhone X retail box surfaces
Hatchimals Surprise egg secret unveiled
   
  5G Accessories Android Galaxy iPhone Rumors Premium smartphones Camera Camera test Nikon SLR Underwater photography   CES CeBIT IFA Photokina PMA