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Bluetooth 2.0+EDR
Ralf Jurrien : July 10th 2007 - 23:40 CET
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GeneralBluetooth 2.0+EDR : Wipro-NewLogic announced the release of its Bluetooth 2.0+EDR baseband RTL and software stack. This low-power Bluetooth 2.0+EDR architecture is upgradeable to Bluetooth 2.1+EDR by software and builds up on the company's silicon-proven and fully certified Bluetooth 1.2 solution. Combined with the Wipro-NewLogic Bluetooth 2.0+EDR radio IP, it offers customers a range of system configurations and can be integrated into any application, host or baseband chips, in the mobile, automotive and consumer markets. "Wipro-Newlogic has a long history in Bluetooth development, being the first company in 2000 to qualify its Bluetooth Core," said Franz Dugand, Product Marketing Manager at Wipro-NewLogic.
Bluetooth 2.0+EDRBluetooth 2.0+EDR technology
Franz Dugand added: "We have licensed our Bluetooth 1.2 solution to a large number of customers worldwide and already a few of our customers have taped out their chip, integrating our Bluetooth 2.0+EDR baseband IP." Bluetooth 2.0+EDR technology offers three times higher transfer rates compared to Bluetooth 1.2 technology - 2.1 Megabits per second (Mbps) compared to 721 Kilobits per second (Kbps). This enables a new range of applications like high definition stereo audio streaming, transfer of large files and fast synchronization. Additionally, the Bluetooth 2.0+EDR technology shows a significant improvement in power consumption over Bluetooth 1.2. Due to the alternative modulation provided by the EDR technology the radio operating in EDR mode will be 3 times less active than a radio operating in Bluetooth 1.2 mode. This results in a significantly higher battery life for applications such as Bluetooth headsets or stereo audio streaming via the A2DP profile from a portable multimedia device to a home or car stereo system.

Bluetooth baseband & Software
Wipro-NewLogic's Bluetooth baseband and software offer design engineers the flexibility to be used with any 16-bit or 32-bit processor, using little endian or big endian convention. It is silicon proven with ARM, ARC and LEON processors, amongst other CPUs. The BOOST Software contains the layers below-HCI (LC, LM, HCI) as well as above HCI, including key profiles such as headset, hands free, HID etc. It supports multiple partitioning options: the hosted configuration allows an easy and standardized partitioning of a Bluetooth system within a two CPU or two chips architecture, while the same software can also be configured in a fully embedded mode, without the need of any HCI.

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