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Nic Rossmüller : November 12th 2006 - 20:58 CET

Samsung 16 chip multi stack package technology


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SamsungSamsung 16 chip multi stack package technology : Samsung, the world leader in advanced memory technology, announced that it has developed the industry’s first process to enable innovative production of a 16-chip multi-chip package (MCP) of memory. The new MCP technology supports the industry-wide demand for small form factors and high-densities that will accommodate multimedia-intensive user applications. Samsung’s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16 gigabyte (GB) MCP solution. Advanced multi-chip package technology requires a combination of key processes such as wafer thinning technology, redistribution layer technology, chip sawing technology and wire bonding technology.
Samsung 16 chip multi stack package technology Samsung wafer thinning technology
To increase the number of chips stacked vertically, the need for further wafer thinning was a critical design obstacle. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns (um). This is just 65 percent the thickness of the 10-chip MCP wafer (45 um) Samsung developed in 2005 and similar to the size of a human cell, which measures 20 to 30 microns.

Samsung multi stack package technology - Laser cutting technology
As part of its MCP breakthrough, Samsung also developed a new laser-cutting technology to cut the wafer into individual chips. This new cutting process prevents the memory chips from breaking into pieces when they are cut using conventional blade sawing technology, which was originally designed only for sawing wafers up to 80 microns thick.

Samsung 16 chip technology - Redistribution layer technology
To vertically stack identically-sized dies (chips), a redistribution layer technology also is applied in Samsung’s new multi-stack MCP process, to enable wafer fabricators to adhere the wire contacts from just one side, unlike the conventional method of extending wire connection from both sides of each chip. Along with a single wire contact per die, the dies are placed in a zigzag stack to minimize the use of space and the length of the wire connectors. Moreover, the thickness of the adhesive has been reduced to 20 microns bringing the height of a 16-die stack to 1.4mm. (A 10-chip MCP uses a 60-micron adhesive layer and has a total height of 1.6mm.)

Samsung 16 chip MCP - Density
Samsung’s new 16-chip MCP was developed just one year after the development of the first 10-chip MCP, widening the company’s lead in MCP advancements over other memory makers to two years. The new 16-chip MCP package technology provides the highest density solution yet developed for the creation of slimmer consumer electronics, in response to the increasing demand for more multimedia features in mobile devices.

About Samsung
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2005 parent company sales of US$56.7 billion and net income of US$7.5 billion. Employing approximately 128,000 people in over 120 offices in 57 countries, the company consists of five main business units: Digital Appliance Business, Digital Media Business, LCD Business, Semiconductor Business and Telecommunication Network Business. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs.





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