Samsung NX500 Sony CyberShot HX90 Canon PowerShot G3 X Panasonic DMC-FZ330 Nikon Coolpix P900 Olympus Stylus 1s
Samsung NX500 Sony CyberShot HX90 Canon PowerShot G3 X Panasonic DMC-FZ330 Nikon Coolpix P900 Olympus Stylus 1s
Lets Go Digital
Powered by True
Counted by
Samsung 16 chip multi stack package technology
Nic Rossmüller : November 12th 2006 - 20:58 CET
Digital Camera Review Test Appareil Photo Numerique Prueba camara digital Digitale Camera Test Dijital Kamera Incelemeleri Digitalkamera Test Digitalkamera
SamsungSamsung 16 chip multi stack package technology : Samsung, the world leader in advanced memory technology, announced that it has developed the industry’s first process to enable innovative production of a 16-chip multi-chip package (MCP) of memory. The new MCP technology supports the industry-wide demand for small form factors and high-densities that will accommodate multimedia-intensive user applications. Samsung’s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16 gigabyte (GB) MCP solution. Advanced multi-chip package technology requires a combination of key processes such as wafer thinning technology, redistribution layer technology, chip sawing technology and wire bonding technology.
Samsung 16 chip multi stack package technology Samsung wafer thinning technology
To increase the number of chips stacked vertically, the need for further wafer thinning was a critical design obstacle. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns (um). This is just 65 percent the thickness of the 10-chip MCP wafer (45 um) Samsung developed in 2005 and similar to the size of a human cell, which measures 20 to 30 microns.

Samsung multi stack package technology - Laser cutting technology
As part of its MCP breakthrough, Samsung also developed a new laser-cutting technology to cut the wafer into individual chips. This new cutting process prevents the memory chips from breaking into pieces when they are cut using conventional blade sawing technology, which was originally designed only for sawing wafers up to 80 microns thick.

Samsung 16 chip technology - Redistribution layer technology
To vertically stack identically-sized dies (chips), a redistribution layer technology also is applied in Samsung’s new multi-stack MCP process, to enable wafer fabricators to adhere the wire contacts from just one side, unlike the conventional method of extending wire connection from both sides of each chip. Along with a single wire contact per die, the dies are placed in a zigzag stack to minimize the use of space and the length of the wire connectors. Moreover, the thickness of the adhesive has been reduced to 20 microns bringing the height of a 16-die stack to 1.4mm. (A 10-chip MCP uses a 60-micron adhesive layer and has a total height of 1.6mm.)

Samsung 16 chip MCP - Density
Samsung’s new 16-chip MCP was developed just one year after the development of the first 10-chip MCP, widening the company’s lead in MCP advancements over other memory makers to two years. The new 16-chip MCP package technology provides the highest density solution yet developed for the creation of slimmer consumer electronics, in response to the increasing demand for more multimedia features in mobile devices.

About Samsung
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2005 parent company sales of US$56.7 billion and net income of US$7.5 billion. Employing approximately 128,000 people in over 120 offices in 57 countries, the company consists of five main business units: Digital Appliance Business, Digital Media Business, LCD Business, Semiconductor Business and Telecommunication Network Business. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs.

   Samsung DRAM
   Samsung PRAM
   Samsung NAND
   Next  Nikon D50 underwater housing Fantasea F-50N
   Previous  OmniVision automotive camera chip sensor
   News by brand:Samsung
   News by category:Flash memory
   News by brand and category:Samsung Flash memory

LetsGoDigital digital camera magazine
Latest Samsung announcements
Samsung Galaxy Note 7 recall in US
Samsung Gear S3 SmartWatch
Samsung Galaxy J-Series of Android smartphones
Galaxy Note7 comparison
Samsung Android tablet with Iris recognition
Samsung Galaxy Note 7 Android smartphone
New Galaxy smartphone with Turbo Speed Technology
New smartphone technology by Samsung
Samsung Galaxy On Pro smartphone series
Samsung removable flash memory cards
Samsung Galaxy S7 Edge Limited Edition
Samsung Galaxy S7 unlocked versions
Samsung GPS sports band and cord-free fitness earbud
Samsung Galaxy S7 available colors
Samsung Gear 360 virtual reality camera
Twitter LetsGoDigital
Latest news headlines
Nikon Pro-Grade FX-Format lenses
Nikon AF-S NIKKOR 70-200mm telephoto zoom lens
Nikon 19mm perspective control lens
Leica Summaron-M 28mm wide-angle lens
Leica Q Titanium gray
ZTE Axon 7 Mini
Sony A6500 test photo gallery
Sony CyberShot RX100V sample photos
Ricoh 360 degree spherical camera
Panasonic Compass Android Security and Services
MWC 2017 Woman in the mobile industry
Mobile World Congress 2017 keynote speakers
Old casino used in new TV commercial from Sony
Panasonic flexible Lithium-ion battery
KPN LoRa network for Internet of Things
  Accessories Android Apps Camcorders Digital cameras Mobile phones Smartphones Software Tablets   CES CeBIT Gadgets IFA Photokina PMA