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Toshiba Dynastron CMOS image sensor
Ralf Jurrien : October 13th 2006 - 00:37 CET
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 Toshiba Dynastron CMOS image sensor : Toshiba America Electronic Components, Inc. today announced the further expansion of its industry-leading Dynastron complementary metal oxide semiconductor (CMOS) image-sensor product line with the addition of two new chips, the 3.2 megapixel ET8EE6-AS CMOS image sensor and 2.0 megapixel ET8EF2-AS CMOS image sensor SoC with integrated image-signal processor (ISP). With a pixel pitch of just 2.2 microns, a significant advance in cell-size miniaturization compared to the 2.7-micron pixel pitch of previous 2- and 3.2-megapixel products, they enable development of smaller, space-saving camera modules for cellular phones and other camera-enabled mobile devices.
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 Toshiba 2.0 & 3.2 MP Dynastron chips
Toshiba Corporation (Toshiba) will be exhibiting the ET8EE6-AS and ET8EF2-AS chips at CEATEC JAPAN 2006 being held from October 3 to October 7 at Makuhari Messe. "With the launch of our new 3.2 megapixel and 2.0 megapixel Dynastron chips, we can meet cell-phone manufacturers' camera-phone requirements for a smaller optical-format image sensor with best-in-class picture quality," said Andrew Burt, vice president of the Imaging and Communications Marketing Group in the ASSP Business Unit at TAEC. "We are geared up to meet anticipated strong demand in the 1/4-inch 2.0 megapixel market space in 2007 and our customers are showing a high level of interest in our 3.2 megapixel device for high-end camera phones as well. Our customers count on Toshiba's huge mass-production capability and continue to design-in our full range of products, including VGA, 1.3 megapixel, 2 megapixel and 3.2 megapixel products. The new devices are also examples of Toshiba's commitment to support its customers with both on-chip and off-chip ISPs to suit various cell-phone system architectures."
Toshiba ET8EE6-AS & ET8EF2-AS image sensors
Toshiba engineers were able to reduce the pixel pitch in both image sensors from 2.7 microns to 2.2 microns while retaining a pixel size capable of recording high-resolution images. With the ET8EE6-AS, Toshiba reduced a 3.2-megapixel image sensor to a 1/3.2 optical format, an improvement over the company's previous 1/2.6-inch format size. ET8EF2-AS achieves a 2.0 megapixel count in a 1/4-inch optical format. The new sensors also offer low-power consumption, smearless imaging and high-speed operation, all essential requirements for personal mobile equipment, including camera phones and personal media centers. (A smear is a vertical stripe in an image and can occur in bright-light conditions, such as direct sunlight.) ET8EF2-AS also integrates an ISP for sophisticated picture effects and advanced camera operations, such as digital zoom, windowing, image downsizing and picture flip.
Toshiba CMOS sensor - Highlights
• Advances in the Toshiba Dynastron technology, including an improved photo-diode configuration and optimized pixel size, brought pixel pitch down to 2.2 microns, with uncompromised image quality. These advances led to a 3.2 megapixel count in a 1/3.2-inch format and 2.0 megapixel count in a 1/4-inch format.
• In video mode, ET8EE6-AS offers high-speed 15fps in QXGA output, and 30fps in 3-to-1 vertical pixel binning. ET8EF2-AS also supports 15fps in UXGA output, and 30fps in VGA output.
• To support simplified design of an optimized camera system, ET8EE6-AS provides integrated automatic blemish detection and correction, gain control and lens shading compensation.
• Features of the ET8EF2-AS include auto white balance, auto luminance control, and automatic blemish correction.
• ET8EF2-AS also incorporates an ISP to provide advanced functions, including: Digital zoom, Windowing to any arbitrary size with panning, Image down sizing with programmable decimation, Picture flip that includes right/left flip and top/bottom flip and Picture effects that include monochrome, negative, sepia, antique, sketch and emboss.
• Both products incorporate a flexible input clock supported by a phase-locked loop circuit.
Toshiba Dynastron ET8EE6-AS - Specifications
• Part Number : ET8EE6-AS
• Optical format : 1/3.2-inch
• Megapixel : Approx. 3.2
• Pixel count : 2,080 (H) x 1,560 (V) (max.)
• Cell size : 2.2 microns (H)
• Output signal RAW data : 12bit parallel/sub LVDS (serial)
• Clock Frequency : 6MHz-20MHz
• Frame rate : 15fps at QXGA output 30fps at 3-to-1 vertical pixel binning
• Interface control : I2C bus
• Power supply : 1.8V (digital), 2.8V (analog, I/O)
• Operating temperature : -20 degrees to 60 degrees C
• Package : Non-diced wafer
Toshiba Dynastron ET8EF2-AS - Specifications
• Part Number : ET8EF2-AS
• Optical format : 1/4-inch
• Megapixel : Approx. 2.0
• Pixel count : 1,664 (H) x 1,248 (V) (max.)
• Cell size : 2.2microns (V)
• Output signal : YUV422/ RGB686/ RGB565/RGB444/RAW (parallel)
• Clock Frequency : 6MHz-20MHz
• Frame rate : 15fps at UXGA output; 30fps at VGA output
• Interface control : I2C bus
• Power supply : 1.8V (digital, I/O), 2.8V (analog)
• Operating temperature: -20 degrees to 60 degrees C
• Package : Non-diced wafer
About Toshiba CMOS image sensor technology
Toshiba is a pioneer and recognized leader in the development of CMOS image sensors with core competencies in advanced sensor technology and sophisticated signal processing technology. Toshiba Dynastron CMOS image sensors employ a special square-pixel design that enables them to achieve high-quality images with low-power consumption, even in low-light conditions. Dynastron CMOS image sensors have proven their superiority in image-quality comparisons by offering demonstrably better color balance and picture quality.
Toshiba ET8EE6-AS & ET8EF2-AS - Price & Availability
Samples of the ET8EE6-AS 3.2-megapixel device are currently available and are priced at $43.00 in 1,000-piece quantities. The devices are in full production at a production rate of 1 million units a month, or greater. Samples of the ET8EF2-AS 2.0-megapixel SoC are available now and are priced at $35.00 in 1,000-piece quantities. Production of the ET8EF2-AS is planned to start at the end of 2006 at a production rate of 1 million units a month, or greater.
About TAEC
Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.
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