Apple iPad Pro 2017 Samsung Galaxy S8 Apple iPhone Edition Samsung Galaxy Note 8 HTC 11 Sony Xperia L1
Apple iPad Pro 2017 Samsung Galaxy S8 Apple iPhone Edition Samsung Galaxy Note 8 HTC 11 Sony Xperia L1
Samsung Galaxy
Powered by True
Counted by
Nic Rossmüller : September 27th 2006 - 12:09 CET

Dongbu provides wafer processing for Foveon Sensors

Digital Camera Review Test Appareil Photo Numerique Prueba camara digital Digitale Camera Test Dijital Kamera Incelemeleri Digitalkamera Test Digitalkamera
FoveonDongbu provides wafer processing for Foveon Sensors : Dongbu Electronics disclosed it has been working closely with Silicon Valley based Foveon since Q4 of 2004 to support the fabless manufacturer’s development of the world’s highest resolution CMOS Sensor (CIS) devices. Volume production of the latest Foveon X3 direct image sensors, featuring resolutions up to 14.1 Megapixels for professional digital photography, will ramp to more than 1,000 8-inch wafers per month utilizing Dongbu’s special CIS wafer processing technology at the 180nm node. Dongbu reports that it has manufactured more than 1,500 pre-production samples of Foveon’s new 14.1 Megapixel device since May to verify the new device’s exceptional performance in silicon.
Dongbu provides wafer processing for Foveon SensorsFoveon X3 image sensor - Sigma SD14
Volume production has begun, and the latest addition to Foveon’s X3 direct image sensor family will soon be available in new professional quality cameras from Sigma Corporation of Japan. Sigma is exhibiting its new SD14 camera during Photokina 2006, which opens its six-day run today in Cologne, Germany. This new professional camera is powered by Foveon’s latest X3 CIS device, enabled by advanced CMOS wafer processing performed by Dongbu. Foveon’s proprietary X3 technology is the only image sensor technology that stacks red, green and blue pixels vertically, increasing the information density of the recorded image while simultaneously eliminating the color sampling artifacts found in other image sensors. The layers of pixels are embedded in silicon to take advantage of the fact that red, green, and blue light penetrate silicon to different depths - enabling the first and only image sensor technology that captures full color at every point in the captured image.

Dongbu CIS wafer processing - Foveon X3
“Our CIS wafer processing is second to none in the foundry industry, and we are very pleased to enable Foveon’s revolutionary pixel-stacking architecture to come to market,” said Dr. Jae Song, Dongbu’s EVP of Marketing. “Foveon’s X3 architecture packs three times as many pixels into a given silicon area, reducing the amount of silicon needed to achieve high resolution." He noted that the savings in silicon area made possible by Foveon’s technology are achieved in the cost-effective 180nm process node. Dr. Song anticipates cost further efficiencies to come from higher foundry productivity and more fully leveraging Foveon technologies in concert with its own expanding IP portfolio. Since Dongbu committed to advancing CIS wafer processing technology about four years ago, the Korean foundry has acquired 20 CIS patents at home and abroad, while consistently improving quality in the areas of resolution, dynamic range and photo-sensitivity.

Foveon image sensor X3 - Dongbu wafer processing
According to Dave Matteucci, Foveon VP of Operations, “We’re very pleased with our new manufacturing partner’s quality, cost and customer service. We look forward to continuing our productive collaboration with Dongbu Electronics as we strategically target high volume market opportunities with ultra-compact high-resolution image sensors.” In addition specializing in CIS wafer processing, Dongbu also focuses on improving wafer processing for both High Voltage and LCD Driver IC (LDI) devices. By enabling the production of specialized devices at ever finer line widths, Dongbu aims to distinguish itself as the preferred “specialty solution partner” among fabless companies large and small.

About Dongbu Electronics
Dongbu Electronics provides world-class CMOS processing for system-on-chip solutions that integrate advanced logic, analog, and mixed-signal technologies. As a “Specialty Solution Partner” in high-growth markets, such as those represented by mobile handsets and flat-panel displays, Dongbu adds high value with specialized processing for CMOS Image Sensor (CIS), High Voltage, Flash, and LCD Driver IC (LDI) functions. Dongbu’s collaborate-and-thrive approach is evident across the entire manufacturing spectrum including prototype development/verification, packaging/module development, complete turnkey solutions, and accelerating time to volume production. The company’s stock is publicly traded under 001830 on the Korea Stock Exchange.

About Foveon
Foveon is a world innovator in the design and development of image sensors and image capture systems for a wide range of digital capture products. At the core of company’s products is the revolutionary Foveon X3 direct image sensor, the world's first image sensor that directly captures color using three layers of pixels. From point-and-shoot digital cameras to high-end professional equipment, Foveon X3 technology offers multiple benefits to consumers and manufacturers alike. X3 Technology provides superior still capture and video performance, the best resolution for a given sensor size, and is cost-effective for a wide range of consumer and imaging applications.

   Foveon X3 sensor
   Sigma SD14
   Sigma DP1
   Next  Muvee and NuCORE to Showcase Multimedia Slideshows
   Previous  Lumix cameras to Photograph UNESCO Photo Project
   News by brand:Foveon
   News by category:Image sensor & Processor
   News by brand and category:Foveon Image sensor & Processor

Android smartphone
Latest Foveon announcements
Royal Photographic Society print exhibition
National Art Museum of Beijing
Royal Photographic Society print exhibition winners
Royal photographic society print exhibition
Dongbu provides wafer processing for Foveon Sensors
Foveon X3 sensor
Royal Photographic Society Award for Foveon sensor
Foveon: first small format full-color sensor
X3F RAW file support Photoshop CS now available
Twitter LetsGoDigital
Latest news headlines
CMOS Image Sensor market report update
The next Smart TV from Samsung ready for the future
LG G6 mini phone
Apple increases App Store prices
Nintendo 2DS XL game system
New Nintendo 3DS XL games
Samsung headquarters 2017 financial report
Samsung financial report and premium product trends
Samsung Mobile device trends and 2017 results
Samsung Display trend forecast and financial report
Samsung Semiconductor trends and financial results
Fidget Spinner the best 2017 gadget
Alternative phone for iPhone Red
Nintendo Switch 2017 game parties
HDR10+ technology explained by Samsung
  5G Accessories Android Galaxy iPhone Camera Mobile phones Rumors Premium Smartphones Smartwatches Tablets TV   CES CeBIT IFA Photokina PMA